封装贴片/插件
温度-40/85/125
包装卷装
质量好
资料请联系唐先生
Stanson Technology was formed in 1981 and the business was concentrated in exporting semiconductor equipment and parts at
Although, it is under heavy competition, Stanson Technology is always able to provide customers with high quality products and acceptable price.
Our wafers are fabed with various foundry houses in Taiwan and China . Packaging and testing are in China .
Our products are approved not only by the local major factories but also by the overseas clients .
DC/DC converters, power MOSFET, LED drivers, etc. for 3C applications such as LCD Moniter/TV, DSC,Disk Array,
MOS是金属氧化物半导体（Metal-Oxide-Semiconductor）的缩写，是一种常见的半导体器件结构。MOS结构由金属电、氧化物绝缘层和半导体材料组成。
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